| abstract |
A chemical mechanical polishing slurry having a pH in the range 1.5 to 3.0 comprising an oxidizing agent such as ferric nitrate, a fluoride containing additive such as hydrofluoric acid in an amount ranging from 0.01 to 0.3 weight percent and an abrasive consisting of fine metal particles, such as fumed alumina and a method for using the fluoride containing additive chemical mechanical polishing slurry to remove tungsten and titanium from substrates. |