| abstract |
As an object of proposing a resin filler a resin filler suitable for filling in the concave portion created on the surface of the wiring substrate or the through-hole formed in the substrate and a construction of a build-up multilayer printed circuit board having an excellent reliability obtained by smoothening the surface of the substrate filled with the resin filler, this invention proposes a solvent-free resin filler filled in the concave portion created on the surface of the wiring substrate or in the through-holes formed in the substrate, which comprises a bisphenol type epoxy resin as a resin component and an imidazole curing agent as a curing agent, and if necessary, inorganic particles as an additive component, and a build-up multilayer printed circuit board using this resin filler. |