http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0783183-A2

Outgoing Links

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62
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classificationIPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-52
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-0203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-58
filingDate 1996-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_78349714ec27a165e6e2c0e9def3dde4
publicationDate 1997-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0783183-A2
titleOfInvention Semiconductor device and method of fabrication
abstract The invention relates to a semiconductor component (1) with at least one semiconductor chip (2) fastened to a carrier part (8) of a component housing (15), which is electrically connected to at least two electrode connection parts (17) provided with connection contacts (16), wherein the component housing (15) has an upper housing part and at least one housing side part, which at least partially surround the semiconductor chip (2). The carrier part (8), to which the semiconductor chip (2) is attached, simultaneously represents the upper housing part of the component housing (15), and the at least two electrode connecting parts (17) provided with connecting contacts (16) are at least in regions as housing side parts of the component housing (15 ) educated.
priorityDate 1996-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 24.