| abstract |
Hot melt packaging adhesive compositions comprising a blend of about 20% to about 50% by weight of an ethylene vinyl acetate copolymer containing from about 15% to about 45% by weight vinyl acetate and having a melt index of less than about 700; about 20% to about 60% by weight of a tackifying resin selected from the group of aliphatic and cycloaliphatic and aromatic hydrocarbon resins and hydrogenated derivatives thereof, and rosin and rosin derivatives, and terpenes and terpene derivatives; about 10% to about 40% by weight of a paraffin wax having a melt point of about 55°C to about 85°C; up to about 20% by weight of a synthetic high melting wax; and about 0% to about 1.5% by weight of an antioxidant is useful for application at temperatures of less than about 154°C. The adhesive is characterized by superior bonding performance, and suprisingly has a viscosity useful for low application temperatures and a density of less than about 0.98. |