| abstract |
A low dielectric resin composition comprising the following components (a) and (b), and the dielectric constant of a coating film formed by this composition being at most 3:n (a) a resin having functional groups in its molecule and being soluble in a solvent; and (b) a partially hydrolyzed condensate of alkoxysilanes of the formula R 1 m R 2 n Si(OR 3 ) 4-m-n , wherein each of R 1 and R 2 which may be the same or different, is a non-hydrolyzable group, R 3 is an alkyl group, and m and n are integers of from 0 to 3 satisfying 0≦m+n≦3 . |