| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1377c9768c441dae204767b8ab8861bf |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0284
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-135
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0112
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0505
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0597
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0571 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-243
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-061 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| filingDate |
1995-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1998-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b6b5ff4261ab40c411c024d2db9f736f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bbc019a756b221fa834791693732df2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_21fc3ec1ea09a5cbc16c75dfd45f76a4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20e000717758a3a36d3563f19848692b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43a60d4080446cf0ccd84c16a2af57ae
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8fa397daf06efd10551a10e0b29981b0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fbd1bb148b2d364ee0e1deb36c04f052 |
| publicationDate |
1998-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0757885-B1 |
| titleOfInvention |
Method of forming metallic conductive patterns on insulating substrates |
| abstract |
The proposed method of forming conductive patterns with solderable or bondable connection regions on insulating substrates involves the following steps: a) application of a metallic coating (M1, M2) to the substrate (U); b) application of an organic galvanically-resistant and etch-resistant protective layer (S) to the metallic coating (M1, M2) in an electrolytic dip bath; c) removal of the protective layer (S) in future connection regions with the aid of laser beam; d) galvanic deposition of an etch-resistant solderable or bondable end surface (E) layer onto the regions of the metallic coating (M1, M2) exposed during step c); e) removal of the protective layer (S) at least in the regions directly adjacent to the future conductive pattern, using a laser beam; f) etching of the regions of metallic coating (M1, M2) exposed during step e) down to the surface of the substrate (U). Only one organic protective layer (S) is thus necessary; this serves as both galvanic resist and etching resist and can if necessary also be applied as a soldering mask. Electrophoretic enamel, which can be structured several times with a laser beam, is used to form the protective layer (S). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10112023-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6806034-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102007005161-B4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102007005161-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-19944908-A1 |
| priorityDate |
1994-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |