| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e08fd85d97265d6c31ab40f372843d81 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-54 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 |
| filingDate |
1996-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f631f4c507008bd94cee2b9d35dc1ee
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a0b27edc4fd6bfb0387d2dbde2bdd7b |
| publicationDate |
1997-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0754741-A2 |
| titleOfInvention |
Room-temperature stable, one-component, thermally-conductive, flexible epoxy adhesives |
| abstract |
A flexible thermally-conductive epoxy-based adhesive composition and method for making the same are provided. The present adhesive composition comprises (a) a polymer mixture comprising at least one polyepoxide resin having a hardness not exceeding a durometer Shore D reading of about 45, when cured with a stoichiometric amount of diethylene triamine ("DETA"), and a substantially stoichiometric amount of at least one latent epoxy resin curing agent; and (b) a thermally-conductive filler. Optional components include secondary epoxy resins, non-reactive flexibilizers, diluents, and processing aids. The present adhesive composition is rheologically stable for weeks or even months at room temperature and is curable in less than one hour at a temperature ranging from about 100°C to 140°C, whereupon the cured adhesive composition exhibits a durometer Shore A of less than about 90 and a thermal conductivity exceeding 0.4 BTU/hr-ft-°F (0.7 W/m-K). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102471459-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102471459-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0794227-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0794227-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7005185-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011012647-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8541512-B2 |
| priorityDate |
1995-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |