| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f75c33ae35e5d1dc4b05e62ec461c17f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0076 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-031
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0048 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D4-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D4-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D4-00 |
| filingDate |
1995-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2000-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9632a438da1b5310ce0b5667c7ea890a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f51c83411a9d96545f6e1e9a8b2df296
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28d40949dcf891b4f963c8e9f3dbcffc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36a10b952052f29f7e43179598b35294 |
| publicationDate |
2000-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0749594-B1 |
| titleOfInvention |
Stable, ionomeric photoresist emulsion and process of preparation and use thereof |
| abstract |
Disclosed are waterborne, stable photoresist compositions and methods of their preparation and use. The compositions are characterized by increased shear and storage stability. The photoresist composition comprises an aqueous emulsion of a 22% or less neutralized carboxylated resin and non-ionic surfactant containing poly(ethylene-oxide) segments, photopolymerizable monomer and photoinitiator. Neutralization is accomplished using either an organic or an inorganic base or mixtures thereof. The photoresist compositions are useful to selectively coat and protect surfaces subjected to corrosive environments, e.g., etchant processes, in the production of circuit traces for electronic circuit boards. |
| priorityDate |
1994-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |