http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0740850-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a0f26a9c2efad3ae086a108f3c04b57d |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1517 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15165 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15153 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01087 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16152 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3731 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-057 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-08 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-057 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 |
| filingDate | 1995-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_155e3ce99bd8465d1b895cf925802bd1 |
| publicationDate | 1996-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-0740850-A1 |
| titleOfInvention | Hermetically sealed hybrid ceramic integrated circuit package |
| abstract | A ceramic base (30) for use in, for example, a hermetically sealed integrated circuit package (54) is herein disclosed. The ceramic base (30) includes an outermost circumferential peripheral portion (32) having a top surface (34), a bottom surface (36), and an inner circumferential edge surface (38). The peripheral portion (32) of the ceramic base (30) is adapted to receive a conventional integrated circuit package leadframe (22) and ceramic lid (28) forming the hermetically sealed integrated circuit package (54). Also, in accordance with the present invention, the peripheral portion (32) of the ceramic base is made from a low thermal conductivity ceramic material. The ceramic base also includes a central portion (42) surrounded by the peripheral portion (32). The central portion (42) has a top surface (44), a bottom surface (46), and an outer circumferential edge surface (48). The central portion (42) of the ceramic base (30) is adapted to have an integrated circuit die (18) attached directly to the top surface (44) of the central portion (42). And in accordance with the present invention, the central portion (42) of the ceramic base (30) is made from a high thermal conductivity ceramic material thereby reducing the thermal resistance of the integrated circuit package (54). |
| priorityDate | 1994-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 38.