http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0734064-A2

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filingDate 1996-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_53782dc2eae61ae4392cd7450efe6073
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publicationDate 1996-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0734064-A2
titleOfInvention Material for forming wiring layer and wiring forming method
abstract A layer forming material is a compound which has a structure of six-membered ring coordinated to Cu and containing Si, and of which general formula is represented by the following chemical formula:n wherein X 1 and X 2 are elements of the VI group of the same or different types which are coordinate-bonded to Cu, and of which examples include O, S, Se, Te and the like, at least one of Y 1 , Y 2 and Y 3 is Si, L is a group which has a double or triple bond and which is able to supply electrons to Cu, and each of R 1 and R 2 is any of SiF 3 , SiH 3 , CF 3 and CH 3 for example.
priorityDate 1995-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5144049-A
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Total number of triples: 26.