| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_65aa22bcc8da87a6c99b46e5dc8b28eb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0388 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 |
| filingDate |
1995-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b329f072ed559f6ae230cc88d4d51621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d6c6e3449fd58270037c0a83e145292f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59a0e8acdf855a7d6aa87a44e774eea9 |
| publicationDate |
1996-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0733683-A1 |
| titleOfInvention |
Photosolder resist ink, printed circuit board, and process for producing the same |
| abstract |
Disclosed herein is a photosensitive solder resist ink capable of development with a dilute alkaline solution. It has a wide pre-curing latitude. It permits the pre-cured board to be stored for a long period of time. It is superior in resolution, sensitivity, and solder resistance. Disclosed also herein is a printed circuit board having good adhesion, chemical resistance, electrical properties, gold plating resistance, solder heat resistance, and electrocorrosion resistance. Disclosed also herein is a process for producing said printed circuit board by using said solder resist ink. n The photosensitive solder resist ink comprises (A) an ultraviolet-curable resin containing 0-20 wt% of aromatic ring moiety which is obtained by reacting a polymer composed of (a) 40-100 mol% of ethylenically unsaturated monomer having an epoxy group and (b) 0-60 mol% of ethylenically unsaturated monomer capable of copolymerization therewith, with (meth)acrylic acid in an amount of 0.7-1.2 equivalents per epoxy equivalent of said polymer and with a saturated or unsaturated polybasic acid anhydride; (B) an epoxy compound soluble in a diluent; (C) a photopolymerization initiator; and (D) a diluent. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1037111-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6896967-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0864926-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0864926-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1324135-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9800759-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6465540-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6399277-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1324135-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6114092-A |
| priorityDate |
1994-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |