| abstract |
A polyetherketone resin composition comprising 5 - 100 parts by weight of carbon fibers having an average fiber diameter of 5 - 20 µm and an average fiber length of 30 - 500 µm per 100 parts by weight of a composition comprising 95 - 50 % by weight of a polyetherketone and 5 - 50 % by weight of a liquid crystal polyester, and a carrier for processing or treating a semi-conductor wafer molded from the above polyetherketone resin composition. Said composition is excellent in molding properties and said carrier is excellent in stiffness, dimensional stability and antistatic properties. n The above liquid crystal polyester includes, for example, those consisting of repeating structural units (I), (II), (III) and (IV), shown below, in a molar ratio (II)/(I) of 0.2 - 1.0, a molar ratio [(III)+(IV)]/(II) of 0.9 - 1.1 and a molar ratio (IV)/(III) of 0 - 1.0. |