| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_14ba71eccbb5f65a22b78f39b3c6ffc3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24942 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5329
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02274
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76801
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31608
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02216 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-318
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-316 |
| filingDate |
1994-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2003-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ae4d01bf3e02557e7ee8fec08e38a241
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41d1bf8f8314d893da8f2b696835c5fb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_155822b955b7e3573c4fa2bd598eeb31 |
| publicationDate |
2003-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0720223-B1 |
| titleOfInvention |
Process for the production of a semiconductor device having better interface adhesion between dielectric layers |
| priorityDate |
1994-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |