| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fd93ca6a78fdf378046996109cf6d115 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L97-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J197-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J161-06 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L97-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J197-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J161-06 |
| filingDate |
1994-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7d26f2065ca9ee1ea3e8023124d2809
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_743c7e333fb726757e5dc9ffea597003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7257a436c9473137228f90ed5607e40c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b864947722170ae7f7ce40f48b76d75
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bd694b5433c2310be8c45096b729537a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a7b7821b80c72820be30eae51f754b1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_750630747c55b95dddae91164ad194e5 |
| publicationDate |
1996-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0693090-A1 |
| titleOfInvention |
Lignin-based formulations for wood composites |
| abstract |
Novel adhesives for wood composites are described. The adhesives comprise a novel combination of an organosolv lignin and a phenol-formaldehyde resin in a weight ratio of from about 0.5:99.5 to about 70:30 based on phenolic solids in said phenol-formaldehyde resin. The adhesives further comprise a modifier which improves the performance of the adhesive. Adhesives comprising an organosolv lignin and a liquid phenol-formaldehyde resin are also described. The organosolv lignin solution is comprised in either an alkaline solution or in a dispersion. Adhesives wherein the organosolv lignin is phenolated or methylolated prior to incorporation with the phenol-formaldehyde resin are also described. Wood composites such as plywood, waferboard, oriented strandboard, particleboard, wallboard and molded products were manufactured using the adhesives of the invention. Results of board testing demonstrate that the wood composites of the invention are competitive with wood composites manufactured using commercial adhesives. |
| priorityDate |
1993-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |