| abstract |
This invention relates to an adhesive composition, comprising: (A) at least one phenolic resole resin; and (B) the product made by reacting (B-1) at least one difunctional epoxy resin, with (B-2) at least one compound represented by the formulan n wherein in Formulae (I) and (II): G, T and Q are each independently functional groups selected from the group consisting of COOH, OH, SH, NH₂, NHR¹, (NHC(=NH)) m NH₂, RCOOH, NR¹₂, C(O)NHR¹, RNR¹₂, ROH, RSH, RNH₂ and RNHR¹, wherein R¹ is a hydrocarbon group, R is an alkylene or alkylidene group and m is a number in the range of 1 to about 4; T can also be R¹, OR¹ or SO₂C₆H₄-NH₂; and Q can also be H. The invention also relates to copper foils having the foregoing adhesive composition adhered to at least one side thereof to enhance the adhesion between said foils and dielectric substrates. The invention also relates to laminates comprising copper foil, a dielectric substrate, and an adhesion-promoting layer comprising the foregoing adhesive composition disposed between and adhered to the foil and the substrate. |