| abstract |
A method of manufacturing a semiconductor device having a package (27) including a base, and a chip mounted on the base, wherein the chip (25,26) has a surface on which an element is formed, the method comprising the steps of (a) fixing the chip (25,26) having a protective coat (21) formed on the surface to the base; and (b) removing the protective coat (21) from the chip (25,26) without touching the chip. |