Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_216a7faed04ec9497c9819cc03c04599 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0781 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8319 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2929 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2919 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01049 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01015 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05599 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73203 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-838 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29101 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-05042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0665 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485 |
filingDate |
1994-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d30e31ea5422030608a6005fda46dbf7 |
publicationDate |
1995-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-0645807-A1 |
titleOfInvention |
Semiconductor device |
abstract |
A semiconductor device having a structure of high-density connection the pitch of which is less than 150 µm. The connection electrodes are free from shortcircuit due to conductive adhesive and solder. The connection can be achieved at a high yield. The semiconductor device comprises a substrate having a plurality of connecting electrodes (17); a semiconductor chip having projecting electrodes (15); a conductive adhesive (18) for bonding the connecting electrodes and projecting electrodes; and a flow preventing member (22) arranged between the connecting electrodes on the substrate in order to prevent shortcircuit between the connecting electrodes. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6057222-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100445569-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-1105397-C http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2292006-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9723904-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9813863-A1 |
priorityDate |
1993-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |