| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c186e9ae8cafab5df5c8d80cfa7b0fa1 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01S5-02469
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01S5-02216
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4817
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-0203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-0203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01S5-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-047 |
| filingDate |
1994-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2003-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41245b5198efafec8ed0d084b958607f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c47113dd2151f374c3024be6baa039b7 |
| publicationDate |
2003-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0645804-B1 |
| titleOfInvention |
Metal casing for semiconductor device having high thermal conductivity and thermal expansion coefficient similar to that of semiconductor and method for manufacturing the same |
| priorityDate |
1993-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |