http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0636671-A1

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filingDate 1993-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b3acf7b4be64d12fad675a025a47b11
publicationDate 1995-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0636671-A1
titleOfInvention Polishing material
abstract Described is a polishing material, particularly a polishing slurry, for particularly hard materials such as silicon carbide. The material comprises diamond particles with a median particle size of around one micrometer and alpha alumina particles with a median size of from about 20 to about 200 nanometers, and the diamond to alumina weight ratio in the material is from 1:30 to 1:90.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017080535-A1
priorityDate 1993-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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