| abstract |
The invention provides a method of improving the adhesion between a polymeric adhesive (20, 22) and an encapsulating material (28) of the type used to encapsulate a semiconductor chip (14). The method involves the treatment of a polymeric adhesive so as to increase the number of bond sites to which the encapsulating material may adhere, thereby improving adhesion of the polymeric adhesive to the encapsulating material. The treatment may comprise oxidation, such as ozone oxidation, or high temperature baking, or plasma ashing, for example. |