| abstract |
Disclosed is an electrical interconnect structure (20) for connecting a substrate (10) to the next level of packaging or to a semiconductor device comprising: n at least one electrically conducting capture pad (22, 24) on the surface of the substrate; n a first layer of polymeric material (30) deposited on the surface of the substrate and the capture pad; n at least one electrically conducting bonding pad (32, 34) deposited on the first layer of polymeric material; n an electrically conducting stud (36) connecting the capture pad and bonding pad through the first layer of polymeric material; n a second layer of polymeric material (40) deposited on the first layer of polymeric material and around the bonding pad, the polymeric material being at the same height as the bonding pad; n a cap (42, 44) of electrically conducting metallization on the bonding pad extending beyond the second layer of polymeric material, the cap being of a different composition than the bonding pad. |