| abstract |
A composition used to form an anisotropic conductive film having a high cure speed, high thermal resistance, high humidity resistance, long shelf life and excellent repair possibilities, which comprises an adhesive composition containing about 100 parts cyanate ester, about 0.01 part to 10 parts of a curing catalyst, about 10 parts to about 300 parts of a film-forming thermoplastic resin and about 10 to about 500 parts of an epoxy resin, as well as about 0.1 part to about 20 parts of conductive particles per hundred parts of the total adhesive composition. |