Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0269 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4629 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-096 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4611 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4061 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5384 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 |
filingDate |
1993-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1925dce4b67ef5a6d09dd85e7bf9e3da http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d518bd537b12e68718a36b043c53541 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7236d92a519c86e4e1f52adfa8f76b6f |
publicationDate |
1994-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-0589813-A1 |
titleOfInvention |
Multilayer ceramic substrate with graded vias |
abstract |
Disclosed is a multilayer ceramic substrate (30) for electronic applications including:n (a) at least one internal layer (32) having vias (34) filled with a metallic material; (b) at least one sealing layer (40) having vias (42) filled with a composite material that is a mixture of ceramic and metallic materials; and (c) at least one transition layer (46) located between the internal and sealing layers having vias (48) filled with a composite material that is a mixture of ceramic and metallic materials but having less ceramic and more metallic material than the sealing layer vias and less metallic material than the internal layer vias. n Also disclosed is a method of forming the multilayer ceramic substrate. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10010396-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015265396-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018256307-A1 |
priorityDate |
1992-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |