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filingDate 1993-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1925dce4b67ef5a6d09dd85e7bf9e3da
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publicationDate 1994-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0589813-A1
titleOfInvention Multilayer ceramic substrate with graded vias
abstract Disclosed is a multilayer ceramic substrate (30) for electronic applications including:n (a) at least one internal layer (32) having vias (34) filled with a metallic material; (b) at least one sealing layer (40) having vias (42) filled with a composite material that is a mixture of ceramic and metallic materials; and (c) at least one transition layer (46) located between the internal and sealing layers having vias (48) filled with a composite material that is a mixture of ceramic and metallic materials but having less ceramic and more metallic material than the sealing layer vias and less metallic material than the internal layer vias. n Also disclosed is a method of forming the multilayer ceramic substrate.
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priorityDate 1992-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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