| abstract |
The present invention relates to a composition and a process of removing rosin solder flux and adherent soil from a printed circuit board. The composition comprises solvating agent and rinsing agent. Wherein the solvating agent is selected from the group consisting of terpenes, terpene-based compounds and rinsing agent is selected from the group consisting of chlorinated hydrocarbons, chlorofluorocarbons, fluorocarbons, hydrofluorocarbons, hydrochlorofluorocarbons, alcohols, fluorinated alcohols and mixture of these. The process for removing rosin solder flux from a circuit board comprises contacting the printed circuit board with a boiling liquid comprises solvating agent and rinsing agent. |