| abstract |
The application of a layer of an active material with respect to high frequency on a substrate insensitive to high frequency and of a thickness required to produce packaging, generates sufficient thermal energy to produce a strong bond between the materials composing the substrate. The active material with respect to the high frequency can be deposited on a part of the internal surface of the substrate, preferably near or at the level of a part of this surface constituting the heat-sealing interface. In this way, the application of additional layers, or the printing of other substances on the surface of the substrate can be carried out without hindering the heat-sealing process. Flexible containers for medical use, which may contain a product maintained under sterile conditions and removed under these same conditions, can be manufactured in industrial apparatuses from these coated substrate materials, insensitive to high frequency. |