| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00 |
| filingDate |
1993-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e6c3dfe871feb22d17dc35fa608662b0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d296cef402099b61ca6e9876c10beb8b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b310bf05eb2279a070a8d4e3be16990
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a3af280f816f19d47c9a20fcf7ca04a |
| publicationDate |
1994-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0578446-A2 |
| titleOfInvention |
Epoxy resin compositions, preparations and uses thereof, semiconductor devices encapsulated therewith |
| abstract |
An epoxy resin composition includes (A) an epoxy resin containing (a) a naphthalene ring-containing epoxy resin and (b) a biphenyl type epoxy resin in a weight ratio of (a)/(b) of from 0.1 to 1, (B) a phenolic resin containing (c) a polyfunctional phenolic resin and (d) a dicyclopentadiene type phenolic resin in a weight ratio of (c)/(d) of from 0.5 to 3, and (C) an inorganic filler. The composition has smooth flow and improved moldability and cures into products which are substantially free of internal voids and have high Tg, high elongation, firm adhesion and low moisture absorption. The composition is molded for encapsulation over semiconductor devices which remain reliable against thermal shocks during surface mounting. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100502533-B1 |
| priorityDate |
1992-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |