| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| filingDate |
1992-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d7e4a63f6bd6223c8a006aacc558722
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0cfb3b62da6d0ebf7845b75adf908e1e |
| publicationDate |
1993-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0570432-A1 |
| titleOfInvention |
Selective process for printed circuit board manufacturing |
| abstract |
New family of catalytic metallization compositions based on palladium. These catalysts are used in a process for the selective deposition of a metal or a substrate when a metallization mask (i.e. a photosensitive varnish) is used on the substrate. Also contemplated are methods and compositions for the manufacture of printed circuit boards based on two metallization phases or on a single metallization phase, the second formulation making use of said "selective" process. The method and composition are generally employed for the electroless deposition on substrates, especially the metallization of plastics, ceramics, anodized aluminum and other materials. |
| priorityDate |
1991-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |