| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24aca9ded2638ea793d05360dde7a4a0 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
1993-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1996-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c972d3780118f9b41a8449dcc9ca3a8e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0d6f7fbc055caedfe0ab9129a732bb20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59d936f58cd695b10d2abf02cc447248
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf964d6b9c9ab619befd857052c1e034
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_380953c5202765903a39da836e5d2c7b |
| publicationDate |
1996-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0567919-B1 |
| titleOfInvention |
Epoxy resin composition and resin-encapsulated semiconductor device |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8674007-B2 |
| priorityDate |
1992-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |