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filingDate 1991-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1994-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_881166800da657a947a8b1bafce06cd5
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publicationDate 1994-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0557278-B1
titleOfInvention A method of making a multilayer thin film structure
abstract A method of making a multilayer thin film structure on the surface of a dielectric substrate which includes the steps of: a) forming a multilayer thin film structure including the steps of: applying a first layer of dielectric polymeric material on the surface of a dielectric substrate, applying a second layer of dielectric polymeric material over the first layer of polymeric material wherein the second polymeric material is photosensitive, imagewise exposing and developing the second polymeric material to form a feature therein, the second layer feature in communication with at least one feature formed in the first polymeric material; and b) filling the features in the entire multilayer structure simultaneously with conductive material. Preferably, the first layer feature is a via and the second layer feature is a capture pad or wiring channel. Also disclosed is a multilayer thin film structure made by this method.
priorityDate 1990-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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