http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0543045-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4ddcb273a108a5d8472b335280098e06 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-241 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09363 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09118 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-426 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-027 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 |
| filingDate | 1991-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7879ad54778d15bcb5a870da321022f |
| publicationDate | 1993-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-0543045-A1 |
| titleOfInvention | Process for manufacturing printed circuit boards |
| abstract | a) die Leiterplatte (1) wird zur Haftung der Metallauflage (3) vorbehandelt; b) eine dünne erste Metallschicht (3) wird aufgetragen; c) die Metallschicht (3) wird in den unmittelbar das spätere Leiterbild angrenzenden Bereichen durch elektromagnetische Strahlung (S) entfernt und zwar durch derartige Einstellung und Führung der Strahlung (S), daß sich eine Trennung der Bahnen und eine Unschädlichmachung der Vorbehandlungsfolgen in der Leiterplatte ergibt; d) die dem Leiterbild entsprechenden Bereiche der Metallschicht (3) werden kathodisch kontaktiert; e) auf die kathodisch kontaktierten Bereiche wird in einem galvanischen Metallabscheidungsbad eine zweite Metallschicht (7) aufgebracht. The invention relates to a method for producing printed circuit boards with the following method steps: a) the circuit board (1) is pretreated to adhere the metal support (3); b) a thin first metal layer (3) is applied; c) the metal layer (3) is removed in the areas immediately adjacent to the subsequent conductor pattern by means of electromagnetic radiation (S), specifically by adjusting and guiding the radiation (S) in such a way that the paths are separated and the pre-treatment sequences in the circuit board are rendered harmless results; d) the areas of the metal layer (3) corresponding to the conductor pattern are contacted cathodically; e) a second metal layer (7) is applied to the cathodically contacted areas in a galvanic metal deposition bath. n n n As a result, very few procedural steps can be used. There is no need to apply resist layers and etching processes. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5525205-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0641152-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5863405-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0711102-A4 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0711102-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-112012000993-B4 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-4447897-B4 |
| priorityDate | 1991-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.