http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0524433-A3
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3218 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07C15-113 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-08 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-08 |
| filingDate | 1992-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1993-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-0524433-A3 |
| titleOfInvention | Poly-hydroxynaphthalene compounds and epoxy resin composition |
| abstract | [Arrangement] n The epoxy resin composition of the present invention ncomprises, as essential components: an epoxy resin ncontaining a polyfunctional epoxy resin prepared from nepihalohydrin and a poly-hydroxynaphthalene compound nwhich has been obtained by copolycondensation of α-naphthol nand β-naphthol with an aldehyde and which has an naverage molecular weight of from 300 to 2000, preferably nfrom 400 to 1500; a curing agent; and a curing promoter. n [Effects] n The epoxy resin composition for encapsulating ICs nof the present invention is high in glass transition npoint of cured resin and excellent in heat stability, nmechanical strength, water absorption and moisture resistance. nFurther, when treated with soldering, the epoxy nresin composition prevents cracking of packages. nThus, the epoxy resin composition of the present invention nis suitable for encapsulating ICs. |
| priorityDate | 1991-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 80.