http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0515786-A1

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B5-3103
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11B5-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01F1-00
filingDate 1992-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f80549865754a843033e4dfb7788b3b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bbd5a6e95c26e528f87d89c3b11024fc
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publicationDate 1992-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0515786-A1
titleOfInvention Thin film tape head assembly
abstract A tape head assembly is formed by depositing a multiplicity of thin film transducers (12) on a ceramic wafer or substrate. The wafer is divided into head bars (16), each of which has one or more thin film transducers (12) on its face. End sections (20A, 20B) and a cover bar (18) are joined to the head bar (16) to form a head bar subassembly. A flexible cable (26) or electrical pins are provided between the end sections to enable electrical connection between the head circuit and external circuitry. By joining a number of head bar subassemblies, a multigap thin film tape head assembly is produced to serve as a read/write device.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5639323-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6611398-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5670253-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1076339-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9800840-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9722967-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0727770-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1076339-A3
priorityDate 1991-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 27.