| abstract |
Disclosed is a method for promoting adhesion of cofired copper-based metallurgy and glass-ceramic dielectric including the step of adding powders of an alloying metal to the copper-based metallurgy prior to firing. n Also disclosed is a metallizing paste exhibiting superior adhesion to glass-ceramics. The paste includes an organic carrier, copper powder and an alloying metal, which may be a non-copper metal powder or a copper-metal alloy. It is preferred that of the metal in the paste, the copper should make up 80-99 weight percent and the alloying metal should make up 1-20 weight percent. |