| abstract |
An epoxy resin composition comprisingn (A) at least one epoxy resin selected from naphthalene ring-containing epoxy resins of the following structural formulae (1) and (2):n n wherein E isn R 0 is a hydrogen atom orn n R 1 is a hydrogen atom or a monovalent hydrocarbon group having 1 to 6 carbon atoms, and n is an integer of from 0 to 5, (B) a phenolic resin, and (C) an inorganic filler. n The compositions have good flow and cure to products having low modulus of elasticity, a low coefficient of expansion, high Tg irrespective of low stresses, and low water adsorption. Semiconductor devices encapsulated with the present composition are highly reliable even after being subject to thermal shocks upon surface mounting. |