| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G61-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L65-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F283-10 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G61-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F283-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L65-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
1992-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_178f832fd3d7a120fde0135ffe7e1b76 |
| publicationDate |
1992-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0506080-A2 |
| titleOfInvention |
Epoxy resin hardener and epoxy resin composition |
| abstract |
An epoxy resin hardener is disclosed, comprising a synthetic resin obtained by the addition reaction of (A) an aromatic hydrocarbon containing a phenolic hydroxyl group with (B) a compound having at least two ethylenically unsaturated double bonds, the synthetic resin having a structure in which the ethylenically unsaturated double bonds in compound (B) have been opened, with a hydrogen atom that was directly bonded to one of the carbon atoms constituting the aromatic ring(s) in hydrocarbon (A) being addition-bonded to the α-position carbon atom in one of the opened double bonds in compound (B) and the β-position carbon atom in the opened double bond in compound (B) being addition-bonded to that carbon atom in the aromatic ring(s) in hydrocarbon (A) from which the hydrogen atom addition-bonded to the α-position carbon atom in the opened double bond in compound (B) has been eliminated. An epoxy resin composition comprising an epoxy resin and the hardener is also disclosed. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1323761-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-4039723-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5739259-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5756655-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5756642-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022167686-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5674970-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5837798-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5773552-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1323761-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5889137-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6399740-B1 |
| priorityDate |
1991-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |