| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d6402b23ab8782152be47b3996e48a4a |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0388 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
| filingDate |
1992-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f841a086900bdb7c650cde1b74629b0d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abd7490848c4bb46b37c0aabaa8090aa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8cb8be2ce886fc5255e0ba88a1a9e09e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20cc333480867b5e8ba57fc4ed9a7699 |
| publicationDate |
1992-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0499271-A1 |
| titleOfInvention |
Photosensitive resin |
| abstract |
A new photosensitive resin prepared by esterifying at least part of an acid anhydride group of a copolymer of indene (or polymerizable components including indenes) and maleic anhydride, optionally, the maleic anhydride partly replaced by maleimide. The negative photosensitive resin of the present invention has high thermal resistance and can be used as a pattern forming material for use in the production of solder resists, etching resists, plating resists and photoresists when it is used alone or combined with other components. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9944100-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100660512-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5759739-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6746817-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6861198-B2 |
| priorityDate |
1991-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |