| abstract |
In one embodiment, the discreet or integrated electronic components are each encapsulated in a package which may, for example, be plastic. The packages are then mounted on a printed circuit board made, for example, from epoxy. The assembled components and board are covered with a first relatively thick layer of an organic compound providing a levelling function, followed by a second layer consisting, for example, of a mineral metallic compound which serves to hermetically seal the assembly. |