Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4be8d1eb45e7fb62479f26a6fa0b3939 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07F1-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-18 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07F1-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-40 |
filingDate |
1991-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
1994-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50ad8ffdea39d69d2bab8f353a3945ae http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_949d87561e6ca2ca6456e3fb3af02f02 |
publicationDate |
1994-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-0472897-B1 |
titleOfInvention |
Process for depositing copper containing layer II |
abstract |
A description is given of the deposition of copper-containing layers on substrates using certain organometallic copper compounds containing cyclopentadiene or substituted cyclopentadiene. The deposition is carried out, in particular, by the CVD process. |
priorityDate |
1990-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |