| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0e433c1625fc509a087c912b440da84b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3733
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-473
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3738 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-473
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 |
| filingDate |
1991-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1997-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d606d084c7926d45f44d6138c6578b9e |
| publicationDate |
1997-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0471552-B1 |
| titleOfInvention |
Heat transfer module for ultra high density and silicon on silicon packaging applications |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102010013734-A1 |
| priorityDate |
1990-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |