| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4be8d1eb45e7fb62479f26a6fa0b3939 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07F9-5045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07F1-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07F1-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07F1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07F9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07F9-50 |
| filingDate |
1991-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50ad8ffdea39d69d2bab8f353a3945ae
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_949d87561e6ca2ca6456e3fb3af02f02 |
| publicationDate |
1992-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0468396-A1 |
| titleOfInvention |
Process for depositing a copper-containing layer |
| abstract |
The deposition of layers containing copper on substrates is described using certain copper compounds. The deposition is carried out in particular using the CVD method. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7393555-B2 |
| priorityDate |
1990-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |