| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_082684197b5db4472f30a96fd2636588 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-387
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-208
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-56 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18 |
| filingDate |
1990-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b96099761b8028b4523ac9484a1e39b0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_acf45d7e383b3cef3ca8ff3ed3581bdf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3d3202be058ad47ffda955b7c93b678 |
| publicationDate |
1991-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0460226-A1 |
| titleOfInvention |
Electroless plating process |
| abstract |
A new process for conducting electroless plating without the necessity for preliminarily corroding the surface of an object, which comprises coating the surface with a solution of a polystyrene elastomer generally used as a heat-fusible adhesive, alone or together with a tackifying resin having a molecular structure similar to that of the elastomer, and forming a metallic layer on the coating film, formed by drying the applied solution, by electroplating. This process can substitute for the conventional electroless plating which has been conducted as a preliminary step of electroplating of synthetic resin and especially aims at applications in the field of electroless plating for preventing electromagnetic interference. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0473069-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0473069-A2 |
| priorityDate |
1989-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |