http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0458984-A4
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L15-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08C19-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08C19-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L15-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 1990-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1992-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-0458984-A4 |
| titleOfInvention | Novel resin, process for preparing the same, and composition comprising the same |
| abstract | A novel hydroxyphenylated resin having excellent thermal stability, weather resistance and electrical properties useful as a resin for a printed circuit board, a resin for sealing a semiconductor, an insulating material, etc.; a process for preparing the same; and a curable epoxy resin composition comprising the same. Specifically, the present invention provides a novel resin containing a number of phenolic hydroxyl groups and having a high softening point and substantially no double bond; a process for preparing the same wherein a butadiene oligomer and a phenol compound are used as the starting materials; and a curable epoxy resin composition comprising the same suitable for applications such as a sealing material. |
| priorityDate | 1989-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.