| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a43cfe2ea914a3f1dcd5ada54250f383 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0376
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09563 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4661
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-465 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
1990-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c96308ae4039faedbde8bd9fb113ec8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5226620de591fb2c4cf6353e45340b07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b75098399064e1f6983ade1894efaca8 |
| publicationDate |
1991-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0451254-A1 |
| titleOfInvention |
MULTILAYER CIRCUIT BOARD WITH MICROPOROUS LAYERS AND MANUFACTURING METHOD THEREOF. |
| abstract |
Moderately hydrophilic, photocompatible, micro-incorporated material (10) onto which metal (24) can be directly deposited using electroless plating techniques, and its use in the preparation of printed circuit boards and circuit components. |
| priorityDate |
1989-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |