| abstract |
A curable resin comprising a resin of the formulan n wherein R¹ and R² each are substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, R³ is a divalent organic group having 1 to 10 carbon atoms, X is a tetravalent organic group having an aromatic ring, Y is a divalent organic group, m is an integer of 1 to 3, and n is an integer of at least 1. The resin is prepared by reacting a polyimide with an aminosilicon compound and can be cured through relatively mild heating into coatings having enhanced substrate adherence and solvent resistance. |