http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0444216-A4
Outgoing Links
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|---|---|
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| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49883 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4061 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49866 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 |
| filingDate | 1990-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1992-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-0444216-A4 |
| titleOfInvention | Via-forming ceramics composition |
| abstract | A via-forming ceramics composition. In order to solve the problem of a gap that generates in the interface of the conductor and the substrate due to insufficient filling of vias caused by the reduction of volume informing vias and to solve the problem of poor adhesion between the conductor and the substrate, the via-forming composition in ceramics includes the following components (a) and (b): (a) at least one metal powder or alloy powder selected from the metal powder of copper, gold, silver, tungsten, molybdenum, nickel, paradium, platinum or aluminum, or the alloy powder thereof; and (b) an organometal compound of an organic silicon compound, organic aluminium compound, organic zirconium compound or organic magnesium compound in an amount of 5 to 40 % by weight with respect to the above metal powder or the alloy powder. In addition to the above components (a) and (b), the via-forming composition of the invention contains the following components (c) and (d): (c) a cellulose derivative or a thermally decomposing organic binder of the type of polymetamethyl acrylate; and (d) a high-boiling organic solvent. The method of forming via in the ceramic substrate consists of forming a hole in a ceramic substrate such as glass-ceramic composite substrate, alumina substrate, magnesia substrate, zirconia substrate, or a green sheet thereof, and filling the thus formed hole with any one of said compositions, followed by baking. |
| priorityDate | 1989-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 57.