Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_26b9490bd12e6f87dbb3bc0f5af29e73 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-085 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-1028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-056 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0284 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F1-68 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F1-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R13-03 |
filingDate |
1990-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ef30dc9ebc6b215cf654857bd23786d6 |
publicationDate |
1991-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-0443097-A1 |
titleOfInvention |
Three dimensional plating or etching process and masks therefor |
abstract |
In a process for plating or etching metalization patterns on the surface of a three dimensional substrate, a flexible plastic mask (200) is fabricated by first coating the surface of a thin plastic sheet with vacuum formable ink (20). The mask (200) is then molded into the shape of the surface (22) into which the pattern is to be formed. A low power YAG laser is used to remove areas of the ink through which light is to be allowed to pass (26). This mask may then be used in either a print and plate process or a print and etch process by drawing the mask into intimate contact with the workpiece by applying a vacuum between the mask (200) and the workpiece (204). The workpiece (204) may then be exposed to light through the clear areas of the mask (200). |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0575849-A2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-4220097-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0903805-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103407296-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0903805-A2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0575849-A3 |
priorityDate |
1990-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |