| abstract |
A soldering flux free from the necessity for cleaning, which prevents active ions in an activator from being liberated upon exposure to a high-temperature atmosphere of 80 °C or above of, for example, an automotive engine room, said flux containing besides the activator: (1) a thermoplastic resin with a softening point of 80 °C or above, and/or (2) an expoxy compound, a radical-polymerizable ethylenically unsaturated compound or a blocked isocyanate compound, or (3) a thermosetting resin comprising both of a carboxylated resin and an epoxy resin and/or a theromosetting resin containing both of carboxyl and epoxy groups. |