http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0440981-A1
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c72d118f5664072de841f9c5c34b9d99 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2379-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S205-926 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1003 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-22 |
filingDate | 1990-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_62a0a9e22c753d6ab48fa6b3b6bd1b19 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad97c717895fef614a3ef2cffd2ee7f2 |
publicationDate | 1991-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | EP-0440981-A1 |
titleOfInvention | Method for treating a polyimide surface for subsequent plating thereon |
abstract | A polyimide surface is pretreated in preparation for an adhesion promotion treatment and subsequent metallization on the surface, wherein the pretreatment comprises the steps of:n (A) contacting the polyimide surface with an aqueous solution of nitric acid having a concentration of about 35 to about 70% by weight or an aqueous solution of hydrochloric acid having a concentration of about 10 to about 38% by weight; (B) rinsing the acid-treated polyimide surface with water so as to substantially remove the acid from the surface of the polyimide; (C) contacting the rinsed polyimide surface with a mild etching agent, resulting in the formation of a residual film on the polyimide surface; (D) contacting the etched polyimide surface with a basic solution, and (E) removing the residual film formed on the surface of the polyimide after contact with the mild etching agent in step (C). n The method of this invention allows both filled and unfilled polyimide substrates to be electroless plated in a consistent manner and provides improved adhesion between the polymer and subsequently deposited metals. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0616049-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0616049-A2 |
priorityDate | 1990-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 145.