| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3218
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-10 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 |
| filingDate |
1990-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1998-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f46d021f88435f7e127c49303eea3ee5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ff9b2956c94e663b78c76f667eb653fb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea3e7f2aa99e2ac70384b177c0d71036 |
| publicationDate |
1998-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0428871-B1 |
| titleOfInvention |
Epoxy resin composition for semiconductor sealing |
| priorityDate |
1989-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |