| abstract |
A radiation-sensitive composition is described, which is comprised ofn (a) a polymer containing repeating units [1] represented by the general formulan wherin R₁ is a trivalent or tetravalent organic residue having at least two carbon atoms, R₂ is a divalent organic residue having at least two carbon atoms, R₃ is hydrogen or an alkali metal counter ion, and n is 1 or 2; (b) a compound containing a radiation-dimerizable or radiation-polymerizable unsaturated bond and an amino group or a quaternary ammonium salt; (c) a non-alicyclic organic compound having a boiling point not lower than 120°C, containing at least one functional linkage selected from the group consisting of ester linkage, ether linkage and ketone linkage, and containing neither amino group nor hydroxyl group; and (d) optionally a sensitizer. This composition can greatly improve the developability and can give heat-resistant polyimide relief patterns with a good edge sharpness and good mechanical properties. |